Supporting program
Our forums, conferences, presentations of application examples and panel discussions will give you additional momentum and background information on the fair's interesting topics. Topics like automation electronics, power electronics, embedded systems, medical electronics and connectors move the electronic-components industry. At electronica South China, you will find answers to your questions on these and other topics.
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Automotive day
To meet the increasing needs of both visitors and exhibitors, “Automotive Day” will be launched at electronica China continually to provide a focused and efficient platform for high-end customers.
Organizer: Messe Muenchen Shanghai Co., Ltd.
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International Power Electronics Innovation Forum (free of charge)
The conference will invite universities, research institutes and well-known manufacturers to jointly discuss Power semiconductors and power supply leading edge - new materials, new devices and new applications, Offshore wind power converter and grid-connected technology and Intelligent motion control - intelligent drive, smart power and robot.
Organizer: Messe Muenchen Shanghai Co., Ltd；
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International Medical Electronics Innovation Forum (free of charge)
International Medical Electronics Innovation Forum will focus on the topics of “Status and Trend of Medical Electronics”, “Wearable Device and IOT for Healthcare”, “AI and 5G in Medicine”.
Organizer: Messe München Shanghai Co., Ltd；
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International Embedded Systems Innovation Forum (free of charge)
The conference will focus on artificial intelligence (AIoT and embedded vision) and the Internet of Things (5G and IoT security), invite industry-leading speakers from industry and universities to present new ideas and perspectives from a new perspective and discuss embedded systems. Development and future.
Organizer: Messe Muenchen
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International Connector Innovation Forum (free of charge)
The conference will discuss The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.; Connector Industry Reliability System Engineering Application Model (Failure Analysis, Test Verification, Quantitative Design, Failure Prevention); Military and Civilian Integration Applications and Innovative Development of Connector Products (High Current, High Voltage, Heat Resistance, Flame Retardant, High Density, Miniaturization, High Speed Transmission and Environmental Resistance); Innovative Development of Intelligent Manufacturing in Connector Industry (Big Data, Artificial Intelligence, Intelligent Production Assembly, Intelligent Online Detection, Internet Technology Services, Smart Logistics, etc.); Integrated Innovation and Application Research of Connectors in Rail Transit, New Energy Vehicles, etc.; Innovative Development and Market Dynamic Analysis of Connectors for 5G Mobile Communication Equipment; The Development Opportunities and Challenges Brought by the 5G Smart Era to the Connector Industry.
Organizer: Messe München Shanghai Co., Ltd.
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