International Connector Innovation Forum (free of charge)

Shenzhen World Exhibition & Convention Center

General Information

  • Date: November 4, 2020 
  • Venue: Shenzhen World Exhibition & Convention Cente
  • Organizer: Messe München
  • Scale: 400

Topics

  • The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.
  • Connector Industry Reliability System Engineering Application Model (Failure Analysis, Test Verification, Quantitative Design, Failure Prevention)
  • Military and Civilian Integration Applications and Innovative Development of Connector Products (High Current, High Voltage, Heat Resistance, Flame Retardant, High Density, Miniaturization, High Speed Transmission and Environmental Resistance)
  • Innovative Development of Intelligent Manufacturing in Connector Industry (Big Data, Artificial Intelligence, Intelligent Production Assembly, Intelligent Online Detection, Internet Technology Services, Smart Logistics, etc.)
  • Research on Integrated Innovation and Application of Connectors in Emerging Industries(Rail transportation, new energy vehicles, 5G communication, etc.)
  • The Development Opportunities and Challenges Brought by the 5G Smart Era to the Connector Industry 

Intended Audience

BYD ⦁ CHANGAN ⦁ DFSK ⦁ GAC Toyota  ⦁ Aptiv ⦁ Yanfeng Adient ⦁ ZF ⦁ HIKVISION ⦁

CRRC Times ⦁ Tyco  ⦁ Molex ⦁ Arsenide ⦁ Basba ⦁ Huawei ⦁ vivo ⦁ Galaxy ⦁ ZTE

 


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  • The Latest Development of Connector Basic Generic Technologies, Such as Design, Materials, Process, Testing, etc.

    Host: Michael ZHOU Shenzhen Connector Industry Association Consultant
Time Topic Guest
Time TopicThe present development and tendency of copper alloy materials used in connector industry Guest

Michael ZHOU
Shenzhen Connector Industry Association Consultant

Time TopicConnectors Market Trends and DuPont Solutions Guest

Richard Chang
Electrical & Electronics Global Marketing Leader of DuPont Transportation & Industrial

Time TopicNew Copper Alloy K58 and K88: high electrical conductivity, high strength and excellent stress relaxation Guest

Sam Gao
Wieland Metals Shenzhen Limited Assistant Manager

Time TopicWhen Intelligent Vehicles Find KMD Alloy Guest

Joshua Liu
KMD prescisecopper alloy(Henan) co.,ltd. Technical Application Manager

  • Development Trend of Connector

    Host: Liangjun Xu Beijing University of Posts and Telecommunications Professor
Time Topic Guest
Time TopicMolex leading technology & product introduction for miniaturization of automotive market Guest

Cosmo Yi
Molex China Business Development Manager

Time Topic Guest

Time TopicSmart Connectivity for IoTEra Guest

YumingSong
BeijingJingbeiComponents Co. Ltd. Chief Scientist Advisor

Time TopicPractical Implementation of Automotive Gigabit Ethernet Links Guest

JallenZhang
Rosenberger Senior FAE Engineer

Time TopicDiscussion of Development Prospects and Hot Topics on Connector Technology Guest

LiangjunXu
Beijing University of Posts and Telecommunications Professor

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